Join us for a free webinar on June 17, 2020 at 1:00 PM ET/10:00 AM PT. Presentation will be between 30 to 45 minutes, with time for questions at end. This informative event will be presented by Dr. Eric Bogatin, Signal Integrity Evangelist Teledyne LeCroy. If your schedule won’t permit you to attend the live presentation, you can still register and receive a link to the recording that will be sent out later, but you must register at least 24 hours before the event time
Ground bounce is a common problem in packages, connectors and circuit boards. And it gets worse with shorter rise times. This insidious problem can cause enough cross talk to break almost any product.
In this webinar, we will look at the principles behind the root cause of ground bounce, how we can measure the ground bounce in your system, and based on the root cause, how we can design ground bounce out of your next product.
Dr. Eric Bogatin
Signal Integrity Evangelist Teledyne LeCroy
Eric Bogatin is currently a Signal Integrity Evangelist with Teledyne LeCroy and the Dean of the Teledyne LeCroy Signal Integrity Academy, at www.beTheSignal.com. Additionally, he is an Adjunct Professor at the University of Colorado – Boulder in the ECEE dept, and technical editor of the Signal Integrity Journal.