You can read Mike Voilette's featured article online at Interference Technology: link... or view only the article: link...
IEEE EMC Society Newsletter Feature
Wind Turbine technology is becoming the norm as more countries install wind-generating capacity to sate the rising energy demands and, maybe, mitigate rising sea levels. more...
A BRIEF HISTORY OF WASHINGTON LABS
To commemorate our 20th anniversary, we've compiled a history of how we started and who keeps us going. We thought it was entertaining and hope you will too.
Please take a few minutes and have a look -
more...
THE
BIRTH OF WILLIE
We're asked
often about the origins of Willie, our lab robot. So,
we're writing an online book about him! We've
published the prologue online.
read about
Willie right here...
T&E
UPDATE
The latest
issue of our newsletter is now available online.
read it here...
ESPRESSO ENGINEERING
Take a peek at our
new desktop video series exploring today's challenges and tomorrow's
solutions in the product engineering arena.
Instructors Tom Van Doren Dr. Tom Van Doren is Professor Emeritus of Electrical and Computer Engineering at the Missouri University of Science & Technology (S&T) and a founding member of the Electromagnetic Compatibility Laboratory. He has conducted research and education in electromagnetic compatibility for the past 27 years. More than 18,000 engineers and technicians from 105 companies and government agencies have attended his "Grounding and Shielding" and "Circuit Board Layout" courses. Currently, 8 US and 9 foreign corporations are sponsoring EMC related research projects at the EMC Laboratory. Dr. Van Doren has received two outstanding teacher awards from S&T, the Richard R. Stoddard award from the IEEE EMC Society for contributions to EMC technology and education, and is a Life Fellow of the IEEE. Much of his professional work has been devoted to helping engineers understand, diagnose, and reduce signal integrity and electrical interference problems.
Todd Hubing
Dr. Todd Hubing is the Michelin Professor for Vehicle Electronic Systems Integration at the Clemson University International Center for Automotive Research in Greenville, SC, USA. There his research focuses on the reliable integration of low-cost, safety-critical electronics in an electromagnetically harsh environment. He is an IEEE Fellow and a Fellow of the Applied Computational Electromagnetics Society. Dr. Hubing holds a BSEE degree from the Massachusetts Institute of Technology, an MSEE degree from Purdue University and a Ph.D. in Electrical Engineering from North Carolina State University. Before coming to Clemson in 2006, he worked for IBM in Research Triangle Park, NC (7 years) and the University of Missouri-Rolla (17 years). He is a past president of the IEEE Electromagnetic Compatibility Society and currently serves the society as the Vice President for Communication Services.
Nancy Hubing
Dr. Nancy Hubing is an engineering educator with 17 years of teaching experience at Missouri University of Science & Technology (formerly University of Missouri-Rolla) in Electrical & Computer Engineering, Basic Engineering, Interdisciplinary Engineering, and as Director of Freshman Engineering. She is particularly interested in engineering education, and has been presented four campus Outstanding Teaching Awards, the IEEE St. Louis Section Outstanding Engineering Educator Award (2002), the DOW Outstanding New Faculty Award for the Mid-West Section of the American Society for Engineering Education (1995), and several paper awards in the area of engineering education. She currently resides in Clemson, South Carolina and has recently started an educational video production company.
Course Description
Grounding & Shielding of Electronic Systems (2 days)
This course explains fundamental grounding, shielding, and signal routing principles; clarifies troublesome terminology; and demonstrates many techniques for identifying and fixing electrical interference problems. The principles will be described as concepts rather than theoretical equations. The emphasis on concepts will make the course useful for people with a wide range of experiences. Several interference mechanisms and shielding techniques will be demonstrated.
Printed Circuit Board Layout for EMC and Signal Integrity (1 day)
This course is a training session on the design and layout of high speed printed circuit boards. The course will stress the fundamental concepts that board designers must understand to avoid electromagnetic compatibility and signal integrity problems.
Note:You may register for one or both courses.
Objectives
Upon completion of the Grounding & Shielding course (days 1 & 2), the participant will be able to:
Identify the dominant noise coupling mechanism in a variety of applications
Apply effective grounding strategies to reduce noise
Understand and apply filtering to reduce conducted noise
Understand and apply methods of reducing capacitively and inductively coupled noise
Apply shielding methods to contain EM fields and reduce noise due to radiation
Upon completion of the PC Board Layout course (day 3), the participant will be able to:
Make good decisions regarding component selection and placement
Apply sound trace routing techniques to reduce interference
Implement effective power distribution and grounding strategies.
Who Should Attend
Engineers and technicians with EMC responsibility
Engineers and technicians involved in PC board design
Day 1: Grounding & Shielding of Electronic Systems
1. Introduction
2. Current Routing & Least Impedance
• Understanding wiring inductance
• DEMO: Path of least impedance
• Controlling the current return path
3. Interference Coupling Mechanisms
• Review of the 4 coupling mechanisms
• Ways to recognize the dominant mechanism
• Equivalent circuit for each mechanism
4. Field Containment, Bandwidth, Balance & Resonance
• Routing to provide field containment
• DEMO: Fields emitted by a coaxial cable
• Relating bandwidth to transition time
• CM currents and impedance imbalance
• Resonances in lumped & distributed circuits
• DEMO: Predicting & reducing resonances
5. Grounding for Safety and Noise Reduction
• Signal routing is not the same as grounding
• Characteristics of a ground structure
• Safety grounding examples
• Single point versus a ground grid
• Avoiding kHz ground loops
• Grounding analog and digital circuits
• Grounding signals to chassis for RF & ESD immunity and to reduce RF emissions
6. Interference Diagnostic Techniques
• Diagnostic analysis & measurement tools
• How to determine the dominant mechanism
• The influence of circuit impedance
• Diagnostic measurement techniques
• Using current and E & H field probes
Day 2: Grounding & Shielding of Electronic Systems (continued)
7. Filtering to Reduce Conducted Noise
• Current blocking & diverting strategies
• Types of filters
• CM and DM filter techniques
• GHz filtering techniques
• Reducing capacitor mutual inductance
• When to use ferrite beads
8. Field Containment Using Self Shielding
• The low cost & wide bandwidth approach
• Signal routing provides the containment
• DEMO: Twisted pair versus coaxial cable
• Misuses of twisted pair
9. Reducing Capacitively Coupled Noise
• DEMO: Capacitive shielding example
• Capacitive noise reduction options
• DEMO: Shield connection for twisted pair
10. Reducing Inductively Coupled Noise
• Reducing mutual inductance
• Eddy current shielding
• Magnetic flux shunting
• DEMO: Magnetic shielding options
11. Electromagnetic Wave Shielding
• Skin effect & RF containment
• Making cable shields effective at GHz
• Sizing air flow openings
• Controlling CM currents
• EM containment is more important than grounding
Day 3: PC Board Layout for EMC and Signal Integrity
1. Introduction
• Impact of layout on product compliance and cost
• Examples of good and bad board layouts
2. Signal Routing and Termination
• Tracing current paths
• Concept of least impedance
• When, where and how to terminate signals
3. Identifying the Unintentional Antennas on a Board
• Essential elements of an antenna
• Cables and enclosures as radiating elements
• Board structures that potentially radiate
4. Noise Sources and Coupling Mechanisms
• Integrated circuits as sources of EMI
• Parasitic oscillations and unexpected noise sources
• ESD and transient susceptibility
• Conducted, electric and magnetic field coupling
5. Circuit Board Grounding, Filtering and Shielding
• Ground vs. signal return
• To-segment or not-to-segment planes
• Filters that work above 100 MHz
• Effective and ineffective shielding
6. DC Power Distribution and Decoupling
• Effective power distribution strategies
• Choosing and locating decoupling capacitors
• Low-inductance capacitor connections
• Isolating PLLs and other sensitive devices
7. Strategies for PCB Layout
• Design guidelines (good and bad)
• Optimizing component placement
• Stack-up and routing priorities
• Common problems that are easily avoided
Full program (both courses, June 15-17): US$1620
Grounding & Shielding course (2 days, June 15-16): US$1080
PC Board Layout course (1 day, June 17): US$540
Early Registration (by May 14): deduct $50 per day
Group* Registration: deduct $25 per day for each person
* Three or more from the same organization registering for the same course
